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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications 124 Engpässe entstehen dabei häufig inThis book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for